Adhesion in microelectronics

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In a single and easily accessible source, this comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics. --

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Title Statements

Full title :Adhesion in microelectronics / edited by K.L. Mittal and Tanweer Ahsan.

Summary

In a single and easily accessible source, this comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics. --

Edition Statements

Publication Date:©2014

Publication Statements

Publisher(s):John Wiley and Sons, Inc
Place of Publication:Hoboken, New Jersey
Language:eng
Publication Date:©2014

The Physical Object

Description:1 online resource

Edition Identifiers

ISBN:9781118831342, 1118831349, 9781118831359, 1118831357, 9781118831373, 1118831373, 1118831330, 9781118831335
oclc:ocn885378211
LC Classification:TK7870.15
Dewey Decimal:621.381/046

Half Title page; Title page; Copyright page; Preface; Acknowledgements; Part 1: Adhesion: Fundamentals and Measurement; Chapter 1: Study of Molecular Bonding or Adhesion by Inelastic Electron Tunneling Spectroscopy, with Special Reference to Microelectronics; 1.1 Introduction; 1.2 Principles of IETS; 1.3 Application of IETS in Microelectronics; 1.4 Prospects; 1.5 Summary; References; Chapter 2: Adhesion Measurement of Thin Films and Coatings: Relevance to Microelectronics.; 2.1. Introduction; 2.2 Mechanical Methods; 2.3 Laser Based Techniques; 2.4 Summary and Remarks; References.

Part 2: Ways to Promote/Enhance AdhesionChapter 3: Tailoring of Interface/Interphase to Promote Metal-Polymer Adhesion; 3.1 Introduction; 3.2 New Concepts for Ideal Design of Metal-Polymer Interfaces with Covalently Bonded Flexible Spacer Molecules; 3.3 Situation at Al Oxide/Hydroxide Surfaces Using Aluminium as Substrate; 3.4. Adhesion Promotion by Non-specific Functionalization of Polyolefin Surfaces; 3.5 Methods for Producing Monosort Functional Groups at Polyolefin Surfaces; 3.6 Reactions and Bond Formation at the Interface; 3.7 Grafting of Spacer Molecules at Polyolefin Surfaces.

3.8 Summary and Co…

Subjects

Adhésifs adhesive Adhesive joints Adhesives Assemblages collés Microelectronic packaging -- Materials Mise sous boîtier (microélectronique) -… TECHNOLOGY & ENGINEERING -- Mechanical