Advanced wirebond interconnection technology

Advanced wirebond interconnection technology

by Prasad, Shankara K.

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Title Statements

  • Full title :Advanced wirebond interconnection technology / by Shankara K. Prasad.

Edition Statements

  • Publication Date:2004.

Publication Statements

Notes

Titre de l'écran-titre (visionné le 8 août 2011).

TRAITEMENT SOMMAIRE.

The Physical Object

  • Description:1 online resource

Edition Identifiers

  • ISBN:9781402077630, 1402077637
  • oclc:ocn748834776
  • LC Classification:TK7836
  • Dewey Decimal:621.381/046

Table of Contents

Cover -- Table of Contents -- Preface -- Acknowledgments -- Chapter 1: Introduction -- 1.1: Wire Bonding Technologies -- 1.2: Advantages of Ball-Wedge Bonding -- 1.3: Advantages of Aluminum Wedge Bonding -- 1.4 Thermocompression Bonding -- 1.5 Comparison of the Three Bonding Technologies -- 1.6 Ultra Fine Pitch Wire Bonding -- Chapter 2: Materials for Wirebonding -- 2.1: Bond Wire Material Requirements and Properties -- 2.2: Choice of material -- 2.3: Wire Manufacturing -- 2.4: Quality of Bondwire -- 2.5: Testing Methods and Specifications -- Chapter 3: Bonding Equipment -- 3.1: Equipment Capability Requirement -- 3.2 Equipment Selection and Procurement -- 3.3 Cost of Ownership -- 3.4 Equipment Performance -- 3.5: Equipment Maintenance -- 3.6: Preventive Maintenance program -- Chapter 4: Process Technology -- 4.1: Process Variables -- 4.2: Process Optimization -- 4.3: Process Control -- 4.4: Process Monitoring -- 4.5: Process Mechanism -- 4.6: Design for Bondability -- 4.7: Process Problems and Solutions -- Chapter 5: Quality -- 5.1 Bond Pull Technology -- 5.2 Ball- Bond Shear Test -- 5.3 Visual Inspection of Bond Quality -- 5.4 Special Tests for Quality -- Chapter 6: Reliability …

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Subjects

Electronic packaging -- Reliability Livre électronique (Descripteur de form… Livres électroniques Microcâblage -- Production Microcâblage (Électronique) Mise sous boîtier (Électronique) Mise sous boîtier (Électronique) -- Fia… Ressource Internet (Descripteur de form… Wire bonding (Electronic packaging) -- …

Writers

Prasad, Shankara K.

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