Title Statements
- Full title :Advanced wirebond interconnection technology / by Shankara K. Prasad.
Edition Statements
- Publication Date:2004.
Publication Statements
- Publisher(s):Kluwer Academic Publishers
- Place of Publication:Boston
- Language:eng
- Publication Date:2004.
The Physical Object
- Description:XXVIII, 668 p. : : il. ; : 24 cm +
Edition Identifiers
- ISBN:1402077629, 9781402077623, 1402077637, 9781402077630
- oclc:ocn928364111
Subjects
Writers
No reviews yet. Be the first to rate this work.
Related Works
more →
Active packaging for various food applications
0.0
Type: Book
Despilfarro cero: la mejora continua a partir de la medic…
Cruelles Ruiz, José Agustín
0.0
Type: Book
Forecasting and management of technology
0.0
Type: Book
Heuristic scheduling systems: with applications to production systems…
Morton, Thomas E.
0.0
Type: Book
Heuristic scheduling systems: with applications to production systems…
Morton, Thomas E.
0.0
Type: Book
Value stream management for the lean office: Eight steps to planning, mapping, and s…
Tapping, Don
0.0
Type: Book
The science and technology of flexible packaging: multilayer films from resin and process…
Morris, Barry Alan
0.0
Type: Book
Card-based control systems for a Lean Work Design: the fundamentals of Kanban, ConWIP, POL…
Thurer, Matthias,, autor
0.0
Type: Book
A first course in quality engineering: integrating statistical and management …
Krishnamoorthi, K. S.
0.0
Type: Book
Wide bandgap semiconductor electronics and devices
0.0
Type: Book
Despilfarro cero: la mejora continua a partir de la medic…
Cruelles Ruiz, José Agustín
0.0
Type: Book
Rate & Review