Advanced wirebond interconnection technology
"Advanced Wirebond Interconnection Technology addresses wire bonding from both manufacturing and reliability perspectives. It analyzes and explores the various factors that one needs to consider: design, materials, processing, equipment, quality testing and reliability engineering, and last but not least, operator training. This book is intended to be a comprehensive source of information and knowledge that enables both a newcomer to the field and a veteran who needs instant information to make…
Read More ↓Title Statements
- Full title :Advanced wirebond interconnection technology / by Shankara K. Prasad.
Summary
"Advanced Wirebond Interconnection Technology addresses wire bonding from both manufacturing and reliability perspectives. It analyzes and explores the various factors that one needs to consider: design, materials, processing, equipment, quality testing and reliability engineering, and last but not least, operator training. This book is intended to be a comprehensive source of information and knowledge that enables both a newcomer to the field and a veteran who needs instant information to make a decision on a process problem. The book explains not only how to do things such as designating a bond pad or a lead finger, how to select a right bond wire, how to design a capillary and how to optimize a bonding process on the factory floor, but the book also explains why to do it that way." "A CD-ROM is included, which contains 2D and 3D animations of many concepts that are discussed in this book. The animations with voice-overs help the reader grasp the ideas faster with visual experience, which leads to better retention."--Jacket
Read More ↓Edition Statements
- Publication Date:©2004.
Publication Statements
- Publisher(s):Kluwer Academic Publishers
- Place of Publication:Boston
- Language:eng
- Publication Date:©2004.
The Physical Object
- Description:1 online resource (xxviii, 668 pages) : : illustrations
Edition Identifiers
- ISBN:1402077637, 9781402077630, 6610148244, 9786610148240, 1280148241, 9781280148248
- DOI:10.1007/b105273
- oclc:ocm55535863
- LC Classification:TK7836
- Dewey Decimal:621.381/046
Table of Contents
Preliminaries -- Contents -- Preface -- Acknowledgments -- Chapter 1: Introduction -- Chapter 2: Materials for Wirebonding -- Chapter 3: Bonding Equipment -- Chapter 4: Process Technology -- Chapter 5: Quality -- Chapter 6: Reliability -- Chapter 7: New Technologies and New Applications for Wire Bonding -- Appendices -- Index -- About the author
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