Electronics reliability and measurement technology: nondestructive evaluation
This book examines electronics reliability and measurement technology. It identifies advances in measurement science and technology for nondestructive evaluation, and it details common measurement trouble spots.
Read More ↓Title Statements
- Full title :Electronics reliability and measurement technology : nondestructive evaluation / edited by Joseph S. Heyman.
Summary
This book examines electronics reliability and measurement technology. It identifies advances in measurement science and technology for nondestructive evaluation, and it details common measurement trouble spots.
Read More ↓Edition Statements
- Publication Date:©1988.
Publication Statements
- Publisher(s):Noyes Data Corp
- Place of Publication:Park Ridge, N.J., U.S.A
- Language:eng
- Publication Date:©1988.
Notes
"The Electronics Reliability and Measurement Technology Workshop was held in June 1986 at NASA Langley Research Center"--Page vii.
Libros electrónicos descargables.
The Physical Object
- Description:1 online resource (xii, 128 p.) : : ill
Edition Identifiers
- ISBN:9780815511717, 081551171X
- oclc:ocn928988580
- LC Classification:TK7874
- Dewey Decimal:621.381/028/7
Table of Contents
Measurement Science and Manufacturing Science Research -- Nondestructive SEM for Surface and Subsurface Wafer Imaging -- Surface Inspection-Research and Development -- Wafer Level Reliability for High-Performance VLSI Design -- Wafer Level Reliability Testing: an Idea Whose Time Has Come -- Micro-Focus X-Ray Imaging -- Measurement of Opaque Film Thickness -- Intelligent Laser Soldering Inspection and Process Control -- Rupture Testing for the Quality Control of Electrodeposited Copper Interconnections in High-Speed, High-Density Circuits -- Heterodyne Holographic Interferometry: High-Resolution Ranging and Displacement Measurement -- ""Whole Wafer"" Scanning Electron Microscopy.
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