IC component sockets

by Liu, Weifeng

Type Book

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Title Statements

Full title :IC component sockets / Weifeng Liu, Michael Pecht.

Edition Statements

Publication Date:©2004.

Publication Statements

Publisher(s):Wiley-Interscience
Place of Publication:Hoboken, N.J
Language:eng
Publication Date:©2004.

The Physical Object

Description:xii, 219 pages : : illustrations ; : 25 cm

Edition Identifiers

ISBN:0471460508, 9780471460503
oclc:ocm54931613
LC Classification:TK7868.P7
Dewey Decimal:621.3815/31

1. IC Component Socket Overview -- 2. Component Socket Properties -- 3. IC Component Socket Materials -- 4. Component Sockets for PTH Packages -- 5. Component Sockets for J-Leaded Packages -- 6. Component Sockets for Gull-wing Packages -- 7. Component Sockets for BGA Packages -- 8. Component Sockets for LGA Packages -- 9. Failure Modes and Mechanisms -- 10. Socket Testing and Qualification -- 11. Reliability Assessment -- 12. Standards and Specifications -- App. B. Socket Manufacturers

Subjects

CHIPS (ELECTRONICS) circuits Circuits imprimés Connecteurs électriques electric connectors Electronic packaging Integrated circuits Microelectronic packaging Mise sous boîtier (Microélectronique) Printed circuits Printed circuits -- Equipment and suppl…