Intelligent integrated systems: technologies, devices and architectures
This book gives a state-of-the-art overview by internationally recognized researchers of the architectures of breakthrough devices required for future intelligent integrated systems. The first section highlights Advanced Silicon-Based CMOS Technologies. New device and functional architectures are reviewed in chapters on Tunneling Field-Effect Transistors and 3-D monolithic Integration, which the alternative materials could possibly use in the future. The way we can augment silicon technologies …
Read More ↓Title Statements
- Full title :Intelligent integrated systems : technologies, devices and architectures / edited by Simon Deleonibus.
Summary
This book gives a state-of-the-art overview by internationally recognized researchers of the architectures of breakthrough devices required for future intelligent integrated systems. The first section highlights Advanced Silicon-Based CMOS Technologies. New device and functional architectures are reviewed in chapters on Tunneling Field-Effect Transistors and 3-D monolithic Integration, which the alternative materials could possibly use in the future. The way we can augment silicon technologies is illustrated by the co-integration of new types of devices, such as molecular.
Read More ↓Edition Statements
- Publication Date:2013.
Publication Statements
- Publisher(s):Pan Stanford Publishing
- Place of Publication:Singapore
- Language:eng
- Publication Date:2013.
The Physical Object
- Description:1 online resource (xiv, 499 pages) : : illustrations
Edition Identifiers
- ISBN:9789814411424, 9814411426
- oclc:on1076613570
- LC Classification:TK7871.99.M44.D34
- Dewey Decimal:621.3815
Table of Contents
Front Cover; Contents; Acknowledgements; Introduction: Intelligent Integrated Systems Forward to Zero Variability and Zero Power!; Part I: Advanced Silicon-Based CMOS Technologies; Chapter 1: From Planar to Trigate and Nanowire Fully Depleted Transistors; Chapter 2: Schottky Source/Drain MOSFETs; Chapter 3: Advances in Silicon-on-Diamond Technology; Chapter 4: GeOI, SiGeOI and New Devices Architectures; Chapter 5: 3D Monolithic Integration; Chapter 6: III-V Quantum Well FETs; Chapter 7: Carbon Integrated Electronics; Chapter 8: Tunneling Field-Effect Transistors: Challenges and Perspectives
Part II: New Paths to Augmented Silicon CMOS TechnologiesChapter 9: Molecular Memories; Chapter 10: Resistive Memories; Chapter 11: High-Frequency Vibrating Nanowire; Chapter 12: Spintronics; Chapter 13: Smart Multiphysics Sensors; Chapter 14: 3D Integration and Wafer-Level Packaging
Subjects
Writers
More from this Series
No reviews yet. Be the first to rate this work.
Related Works
more →
Kristalle, Elektronen, Transistoren: von der Gelehrtenstube zur Industriefor…
Eckert, Michael
Rate & Review