Title Statements
- Full title :Microelectronics Failure Analysis Desk Reference.
Edition Statements
- Publication Date:2010.
- Edition:6th ed
Publication Statements
- Publisher(s):A S M International
- Place of Publication:Materials Park
- Language:eng
- Publication Date:2010.
Notes
""Ultra-high Resolution in the Scanning Electron Microscope""
The Physical Object
- Description:1 online resource (672 pages)
Edition Identifiers
- ISBN:9781615037261, 1615037268
- oclc:ocn923571038
- LC Classification:TK7871.M52 2011eb
- Dewey Decimal:621.381
Table of Contents
""Title Page""; ""Copyright Page""; ""Contents""; ""Preface to the Sixth Edition""; ""Section 1: Introduction""; ""The Failure Analysis Process""; ""Section 2: Failure Analysis Process Overviews""; ""System Level Failure Analysis Process: Making Failure Analysis a Value Add Proposition in Today�s High Speed Low Cost PC Environment""; ""Board Level Failure Mechanisms and Analysis in Hand-held Electronic Products""; ""Failure Analysis Flow for Package Failures""; ""Chip-Scale Packages and Their Failure Analysis Challenges""; ""Wafer Level Failure Analysis Process Flow""
""Failure Analysis of Microelectromechanical Systems (MEMS)""""Failure Analysis and Reliability of Optoelectronic Devices""; ""Solar Photovoltaic Module Failure Analysis""; ""DRAM Failure Analysis and Defect Localization Techniques""; ""Failure Analysis of Passive Components""; ""Section 3: Failure Analysis Topics""; ""Reliability and Quality Basics for Failure Analysts""; ""Electronics and Failure Analysis""; ""Submicron CMOS Devices""; ""Analog Device and Circuit Characterization""; ""Screening for Counterfeit Electronic Parts""; ""Section 4: Fault Verification and Classification""
""An Overview of Analog Desig…
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