Microelectronics failure analysis

Microelectronics failure analysis: desk reference

by Gandhi, Tejinder

Type Book
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Title Statements

  • Full title :Microelectronics failure analysis : desk reference / edited by Tejinder Gandhi.

Edition Statements

  • Publication Date:©2019
  • Edition:Seventh edition

Publication Statements

  • Publisher(s):ASM International
  • Place of Publication:Materials Park, Ohio
  • Language:eng
  • Publication Date:©2019

Notes

"An ASM materials solutions publication."

"EDFAS, Electronic Device Failure Analysis Society, ASM International."

The Physical Object

  • Description:1 online resource (xi, 705 pages) : : illustrations (some color)

Edition Identifiers

  • ISBN:9781627082471, 1627082476, 9781627082464, 1627082468, 9781523126323, 1523126329
  • oclc:on1128706105
  • LC Classification:TK7871
  • Dewey Decimal:621.381

Table of Contents

Intro; 01_Overview of Wafer-level Electrical Failure_Pai inputs_addressed; 03_EDFAS Desk Reference Paper -- Susan Li -- 8-5-2019 -- Final; 04_Non-destructive Techniques for Advanced Board Level Failure Analysis; 05_EDFAS Desk Refrence -- FA Lab management article-final; 06_07A Optical Microscopy for Desk Reference 2010_corrected; 07_X-ray imaging tools for electronic device failure analysis_CSFinal_V4; 08_!PUB-2019_EDFAS_SAM_Update_Final-20190731; Acoustic Microscopy of Semiconductor Packages; Cheryl D. Hartfield; Carl Zeiss SMT Inc., Pleasanton, CA, USA; cheryl.hartfield@zeiss.com

Thomas M. MooreWaviks Inc., Dallas, TX, USA; tom.moore@waviks.com; Sebastian Brand; Fraunhofer IMWS, Halle, Germany; sebastian.brand@imws.fraunhofer.de; Introduction; History; The C-scan; The Stanford SAM; Today's SAM for IC Package Inspection; Early SAM Applications in the IC Industry; An Important Tool for Popcorn Crack Detection; Theoretical Considerations; Overview: Acoustic Microscopy for IC Package Inspection; Types of Reflected Signal Analysis Modes:; Polarity Analysis of Reflected Signals; Time of Flight Imaging Using Reflected Signals; Resolution and Sensitivity of SAM Inspection

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