Title Statements
- Full title :Microwave power amplifier design with MMIC modules / Howard Hausman.
Edition Statements
- Publication Date:2018
Publication Statements
- Publisher(s):Artech House
- Place of Publication:Norwood, MA
- Language:eng
- Publication Date:2018
The Physical Object
- Description:xxii, 366 pages ; : 27 cm.
Edition Identifiers
- ISBN:163081346X, 9781630813468
- oclc:on1028165298
- LC Classification:TK7871.58.P6
- Dewey Decimal:621.3841/2
Table of Contents
Machine generated contents note: 1.1.Introduction to Designing Microwave Solid State Power Amplifiers -- 1.2.Applications of SSPAs -- 1.3.A Typical SSPA Configuration -- 1.4.Typical Documents Starting a Project -- 1.5.General Format of the SCD -- 1.5.1.Paragraph 1.0: Scope -- 1.5.2.Paragraph 2.0: Applicable Documents -- 1.5.3.Paragraph 3.0: Requirements -- 1.5.4.Paragraph 4.0: Verification -- 1.5.5.Paragraph 5.0: Packaging -- 1.5.6.Paragraph 6.0: Notes -- 1.6.Requirements Section of an SCD -- 1.6.1.Electrical Requirements -- 1.6.2.Mechanical Requirements -- 1.6.3.Environmental Requirements -- 1.6.4.Other Design Criteria -- References -- ch. 2 Lumped Components in RF and Microwave Circuitry -- 2.1.Applicability of Lumped Element Analysis -- 2.1.1.Calculating Wavelengths -- 2.1.2.Example: Calculating Wavelengths for Lumped Circuit Analysis -- 2.2.Capacitor Characteristics at High Frequencies -- 2.2.1.Single-Layer and Multilayer Capacitor Construction
Note continued: 2.2.2.High-Frequency Capacitor Models -- 2.2.3.Capacitor Losses (Q) -- 2.2.4.Capacitor Resonance -- 2.3.Resistor Characteristics at High Frequencies -- 2.3.1.High-Frequency Surface Mount Resistors -- 2.3.2.Flip-Chip Sur…
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