Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore

Title Statements

• Full title :Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore

Edition Statements

• Publication Date:Nov. 2019

Publication Statements

• Publisher(s):Elsevier Science & Technology, Woodhead Publishing Limited [Imprint]
• Place of Publication:Oxford
• Language:eng
• Publication Date:Nov. 2019

The Physical Object

• Description:1 online resource.

Edition Identifiers

• ISBN:9780081025321, 0081025327
• oclc:on1151920679

Writers

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