Modeling, analysis, design, and tests for electronics packaging beyond Moore

Title Statements

• Full title :Modeling, analysis, design, and tests for electronics packaging beyond Moore / Hengyun Zhang [aut]; Faxing Che [aut]; Tingyu Lin [aut]; Wensheng Zhao [aut]

Edition Statements

• Publication Date:2020

Publication Statements

• Publisher(s):Woodhead Publishing, an imprint of Elsevier
• Place of Publication:Duxford, United Kingdom
• Language:eng
• Publication Date:2020

The Physical Object

• Description:1 online resource

Edition Identifiers

• ISBN:9780081025338, 0081025335
• oclc:on1281862955

Writers