Title Statements
- Full title :Modelling methodlogies in analogue integrated circuit design / edited by Günhan Dündar and Mustafa Berke Yelten
Summary
This book provides a holistic view of modelling for analogue, high frequency, mixed signal, and heterogeneous systems for designers working towards improving efficiency, reducing design times, and addressing the challenges of representing aging, variability, and other technical challenges at the nanometre scale.
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- Publication Date:©2020
Publication Statements
- Publisher(s):Institution of Engineering and Technology
- Place of Publication:London
- Language:eng
- Publication Date:©2020
The Physical Object
- Description:xii, 305 pages : : illustrations, charts ; : 24 cm
Edition Identifiers
- ISBN:9781785616952, 1785616951
- oclc:on1117556578
- LC Classification:TK7867
- Dewey Decimal:621.3815015118
Table of Contents
Introduction / Gündhan Dündar and Mustafa Berke Yelten -- Response surface modeling / Jun Tao, Xuan Zeng, and Xin Li -- Machine learning / Olcay Taner Yıldız -- Data-driven and physics-based modeling / Slawomir Koziel -- Verification of modeling : metrics and methodologies / Ahmad Tarraf and Lars Hedrich -- An overview of modern, automated analog circuit modeling methods : similarities, strengths, and limitations / Alex Doboli and Ciro D'Agostino -- On the usage of machine-learning techniques for the accurate modeling of integrated inductors for RF applications / Fábio Passos, Elisenda Roca, Rafael Castro-López an Francisco V. Fernández -- Modeling of variability and reliability in analog circuits / Javier Martin-Martinez, Javier Diaz-Fortuny, Antonio Toro-Frias, Pablo Martin-Lloret, Pablo Saraza-Canflanca, Rafael Castro-Lopez, Rosana Rodriguez, Elisenda Roca, Francisco V. Fernandez, and Montserrat Nafria -- Modeling of pipeline ADC functionality and nonidealities / Enver Derun Karabeyoğlu and Tufan Coşkun Karalar -- Power systems modelling / Jindrich Svorc, Rupert Howes, Pier Cavallini, and Kemal Ozanoglu -- A case study for MEMS modelling : efficient design and layout of 3D acce…
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