Polymeric materials for electronics packaging and interconnection

Polymeric materials for electronics packaging and interconnection

by Lupinski, John H. Moore, Robert S.

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Title Statements

  • Full title :Polymeric materials for electronics packaging and interconnection / John H. Lupinski, editor, Robert S. Moore, editor.

Edition Statements

  • Publication Date:1989.

Publication Statements

Notes

A la portada: "Developed from a symposium sponsored by the Divisions of Polymeric Materials: Science and Engineering and of Polymer Chemistry, Inc. at the 196th National Meeting of the American Chemical Society, Los Angeles, California, September 25-30, 1988."

The Physical Object

  • Description:XI, 499 p. ; : 24 cm.

Edition Identifiers

  • ISBN:0841216797, 9780841216792
  • oclc:ocn804385614

Subjects

Congressos Congressos i conferències Polímers

Writers

Lupinski, John H. Moore, Robert S.

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