Semiconductor packaging

Semiconductor packaging: a multidisciplinary approach

by Hannemann, Robert J. Kraus, Allan D. Pecht, Michael

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Title Statements

  • Full title :Semiconductor packaging : a multidisciplinary approach / edited by Robert J. Hannemann, Allan D. Kraus, Michael Pecht.

Edition Statements

  • Publication Date:1994.

Publication Statements

  • Publisher(s):J. Wiley and Sons
  • Place of Publication:New York, N.Y
  • Language:eng
  • Publication Date:1994.

Notes

"A Wiley-interscience publication"

The Physical Object

  • Description:x, 887 p. : : ill., formules.

Edition Identifiers

  • ISBN:0471181234, 9780471181231, 0471532991, 9780471532996
  • oclc:ocn798866484
  • LC Classification:TK7871.85

Subjects

Assemblage Produit

Writers

Hannemann, Robert J. Kraus, Allan D. Pecht, Michael

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