Semiconductor Packaging

by Chen, Andrea

Type Book
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In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable p…

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Title Statements

  • Full title :Semiconductor Packaging / Chen, Andrea.

Summary

In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.

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Edition Statements

  • Publication Date:2016.
  • Edition:1st edition

Publication Statements

  • Publisher(s):CRC Press
  • Language:eng
  • Publication Date:2016.

The Physical Object

  • Description:1 online resource (216 pages)

Edition Identifiers

  • oclc:on1162605980

Subjects

Microelectronic packaging Mise sous boîtier (Microélectronique)

Writers

Chen, Andrea Lo, Randy

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