TSV 3D RF INTEGRATION: high resistivity si interposer technology

Title Statements

• Full title :TSV 3D RF INTEGRATION : high resistivity si interposer technology.

Edition Statements

• Publication Date:2022.

Publication Statements

• Publisher(s):Elsevier Health Science
• Place of Publication:S.l
• Language:eng
• Publication Date:2022.

The Physical Object

• Description:1 online resource

Edition Identifiers

• ISBN:9780323996037, 0323996035
• oclc:on1313386368

Writers