Wireless interface technologies for 3D IC and module integration

Wireless interface technologies for 3D IC and module integration

by Kuroda, Tadahiro

Type Book
Rate 0.0 /5
Details
Files
Reviews
Download

Title Statements

  • Full title :Wireless interface technologies for 3D IC and module integration / Tadahiro Kuroda, Wai-Yeung Yip.

Edition Statements

  • Publication Date:2021

Publication Statements

The Physical Object

  • Description:xii, 323 Seiten : : Illustrationen, Diagramme

Edition Identifiers

  • ISBN:9781108841214, 110884121X
  • oclc:on1317697518

Subjects

Dreidimensionale Integration Integrierte Schaltung Nahfeldkommunikation

Writers

Kuroda, Tadahiro Yip, Wai-Yeung

Rate & Review

0.0/5
(0 people Voted)

No reviews yet. Be the first to rate this work.

Files & Downloads

  • Wireless Interface Technologies for 3D IC and Mod…

    PDF · 33.5 MB · updated
    Login →
Log in to request a copy