Title Statements
- Full title :Microelectronics failure analysis : desk reference / edited by Tejinder Gandhi.
Edition Statements
- Publication Date:©2019
- Edition:Seventh edition
Publication Statements
- Publisher(s):ASM International
- Place of Publication:Materials Park, Ohio
- Language:eng
- Publication Date:©2019
Notes
"An ASM materials solutions publication."
"EDFAS, Electronic Device Failure Analysis Society, ASM International."
Includes bibliographical references and indexes.
The Physical Object
- Description:xi, 705 pages : illustrations (some color) : 28 cm
Edition Identifiers
- ISBN:9781627082457, 162708245X
- oclc:on1345252662
- LC Classification:TK7871
- Dewey Decimal:621.381
Table of Contents
section 1. Failure analysis process and management. Overview of wafer-level electrical failure analysis process for accelerated yield engineering / S.H. Goh, Y.H. Chan, B.L. Yeoh, H. Hao, M.H. Thor, Z. Lin, C.M. Chua, S.H. Tan, L.S. Koh, and W.P. Chua ; Package failure analysis : flow and technique / Tejinder Gandhi and Jason Silva ; Chip-scale packaging and its failure analysis challenges / Susan Xia Li ; Nondestructive techniques for advanced board level failure analysis / Christian Schmidt ; Failure analysis laboratory management principles and practices / Richard J. Ross and Zhiyong Wang -- section 2. Incoming inspection tools. Optical microscopy / John McDonald ; X-ray imaging tools for electronic device failure analysis / Christian Schmidt ; Acoustic microscopy of semiconductor packages / Cheryl D. Hartfield, Thomas M. Moore, and Sebastian Brand -- section 3. Fault isolation. Diagnosis of scan logic and diagnosis driven failure analysis / Srikanth Venkataraman, Martin Keim, and Geir Eide ; Magnetic field imaging for electrical fault isolation / A. Orozco ; Fault isolation using time domain reflectometry, electro optical terahertz pulse reflectometry and time domain transmiss…
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