Optical materials: microstructuring surfaces with off-electrode plasma

Cover -- Half Title -- Title -- Copyright -- Contents -- Foreword -- Preface -- Authors -- Chapter 1 Forming Directed Fluxes of Low-Temperature Plasma with High-Voltage Gas Discharge outside the Electrode Gap -- 1.1 Overview of Devices Used for Generating Low-Temperature High-Voltage Gas-Discharge Plasma -- 1.2 Features of Low-Temperature Off-Electrode Plasma Generated by High-Voltage Gas Discharge -- 1.3 Design Changes to the High-Voltage Gas- Discharge Device -- 1.4 New Devices for Generating Directed Fluxes of Low-Temperature Off-Electrode Plasma -- 1.4.1 Multibeam Gas-Discharge Plasma Generator -- 1.4.2 Gas-Discharge Plasma Focuser -- 1.5 Chapter Summary -- Chapter 2 Methods for Quickly Measuring Surface Cleanliness -- 2.1 Overview of Methods for Quickly Measuring Surface Cleanliness -- 2.1.1 Method of Frustrated Multiple Internal Reflection Spectroscopy -- 2.1.2 Method of Measuring the Volta Potential -- 2.1.3 Methods for Evaluating Cleaning Efficiency Based on Wettability of the Substrate Surface -- 2.1.4 Tribometric Method -- 2.2 Design Changes to the Tribometer -- 2.3 Operating Regimes and Parameters of the Tribometer -- 2.4 Determining the Evaluation Criterion of a Technologically Clean Surface -- 2.5 Tribometric Effect of the Substrate-Probe on the Structure of the Test Surface -- 2.6 Measuring Surface Cleanliness with the Tribometric Method -- 2.7 A Cleanliness Analyzer Based on Analysis of Drop Behavior -- 2.8 Evaluating the Cleanliness of a Substrate from the Dynamic State of a Liquid Drop Deposited on Its Surface -- 2.8.1 Description of the Experimental Method -- 2.8.1.1 Sample Preparation -- 2.8.2 Description of the Experimental Procedure -- 2.9 Specifications of the Micro- and Nanoroughness Analyzer -- 2.10 Design Changes to the Micro- and Nanoroughness Analyzer -- 2.10.1 Requirements for the Automatic Dispenser.

2.10.2 Compatibility of the Pump's Control Module and the Analyzer's Software -- 2.10.3 Overview of the Operation of the Modified Analyzer -- 2.11 Chapter Summary -- Chapter 3 Increasing the Degree of Surface Cleanliness with Low-Temperature Off-Electrode Plasma -- 3.1 Overview of Methods for Surface Cleaning -- 3.1.1 Chemical Cleaning -- 3.1.2 Laser Cleaning -- 3.1.3 Low-Temperature Plasma Cleaning -- 3.2 Formation Mechanisms of Surface Properties -- 3.3 Molecular Structure Analysis of the Organic Contaminant -- 3.4 Preparing Initial Samples with a Given Degree of Contamination -- 3.5 Analysis of Plasma Particles Impinging on the Surface Being Treated -- 3.6 Mechanism of Surface Cleaning with Directed Fluxes of Low-Temperature Off-Electrode Plasma -- 3.6.1 Cleaning Mechanism -- 3.6.2 Cleaning Model: Primary Expressions -- 3.7 Experimental Investigation into the Relationship between the Degree of Surface Cleanliness and Physical Plasma Parameters -- 3.8 Procedure for Final Surface Cleaning with Off-­Electrode Plasma -- 3.9 Chapter Summary -- Chapter 4 Adhesion in Metal-Dielectric Structures after Surface Bombardment with an Ion-Electron Flux -- 4.1 Adhesion-Enhancing Mechanism -- 4.2 Adhesion Model: Primary Expressions -- 4.3 Experimental Investigation into the Effect of Ion-­Electron Bombardment Parameters on Adhesion -- 4.4 Depositing Highly Adhesive Masks -- 4.5 Chapter Summary -- Chapter 5 Etching the Surface Microreliefs of Optical Materials in Off-Electrode Plasma -- 5.1 Preparing Samples for an Experiment in Etching the Surface Microreliefs of Optical Materials in Off-Electrode Plasma -- 5.2 Mechanisms of Plasma-Chemical and Ion-Chemical Surface Etching -- 5.3 Etching Model: Primary Expressions -- Algorithm and Software for Calculating the Etch Rate.

5.4 Experimental Investigation into the Relationship between the Etch Rate and Physical Plasma Parameters -- 5.5 Relationship between the Etch Rate and Substrate Temperature -- 5.5.1 Method for Determining the Temperature of a Surface at a Site Where a Low-Temperature Plasma Flux Is Incident on the Surface -- 5.5.2 Experimental Investigation into the Relationship between the Etch Rate and Substrate Temperature -- 5.6 Effect of Bulk Modification of Polymers in a Directed Low-Temperature Plasma Flux -- 5.7 Etching Quality of Optical Materials -- 5.8 Fabricating Microreliefs on the Surfaces of Optical Materials through Plasma-Chemical Etching in Off-Electrode Plasma -- 5.9 Fabricating Microreliefs on the Surfaces of Optical Materials through Ion-Chemical Etching in Off-Electrode Plasma -- 5.10 Chapter Summary -- Chapter 6 Generating a Catalytic Mask for the Microrelief of an Optical Element When an Al-Si Structure Is Irradiated by High-Voltage Gas-Discharge Particles -- 6.1 Entrainment of Silicon Atoms by Vacancies Formed in an Aluminum Melt When Its Surface Is Exposed to High-Voltage Gas-Discharge Particles -- 6.2 Analytical Description of Silicon Dissolution in an Aluminum Melt -- 6.2.1 Conservative Difference Scheme for Diffusion Equations -- 6.2.2 Difference Solution to the Mixed Problem -- 6.2.3 Analysis of Numerical Results -- 6.3 Analysis of Experimental Data -- 6.4 Fabricating a Microrelief Based on a Catalytic Mask Formed in Off-Electrode Plasma -- 6.5 Chapter Summary -- Conclusion -- Appendix A: Statistical Analysis of Experimental Results -- References -- Index.