Au/PbSn joints are widely used in the microelectronics industry. Intermetallic formation in Au/60Sn-40wt. %Pb and in Au/62Sn-36Pb-2wt. %Ag systems has been studied in the temperature range 80°C-160°C using diffusion couples. Interdiffusion between Au films and 60Sn-40wt. %Pb sol…
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