Jing Li

Aggressive scaling of Silicon CMOS feature size has led to increased integration density and improved system performance. However, when scaling approaches its fundamental limit, it is extremely difficult to carry it further along Moore's law curve. To meet the continuously incre…

The lead-free requirement in electronics has significantly impacted second-level interconnection reliability due to modification of the solder alloy, laminate material and related assembly processes. Pad cratering, which refers to the fracturing of the resin under the connecting…