PrefaceAbout the EditorsContributors3D Integration Technology with TSV and IMC Bonding; Katsuyuki SakumaWafer-Level Three-Dimensional ICs for Advanced CMOS Integration; Ronald J. Gutmann and Jian-Qiang LuIntegration of Graphics Processing Cores with Microprocessors; Deepak C. Se…
Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth pro…
This book provides theoretical and practical approach in the area of multimedia and IOT applications and performance analysis. Further, multimedia communication, deep learning models to multimedia data and the new (IOT) approaches are also covered. It addresses the complete func…
