Mechanics and materials for electronic packaging: presented at 1994 International Mechanical Engine… by American Society of Mechanical Engineers, Applied Mechanics Division, International Mechanical Engineering Congress and Exposition, Chicago, Ill.) fromAMD (Series) 0 Type: Book
Mechanics and materials for electronic packaging: presented at 1994 International Mechanical Engine… by American Society of Mechanical Engineers, Applied Mechanics Division, International Mechanical Engineering Congress and Exposition, Chicago, Ill.) fromAMD (Series) 0 Type: Book
