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Derived from the highly acclaimed series Materials Science and Technology, this book covers the properties as well as the present and emerging applications of intermetallics. Mechanical characteristics, microstructure as well as the environmental influence on intermetallics are …
The demands for high density, fine pitch interconnections in electronics systems has seen solder-based approaches for such interconnections miniaturized to the scale of tens of micro meters. At such a small scale, such 'micro joints' may contain only one or a few grains and the …
