This book, as the fourth volume, continues the previously founded by the author series of books on ultra-high temperature materials with melting (sublimation or decomposition) points around or over 2500 C. In this quality the book has over-branched cross-links with the sections …
Annotation
Materials for high-temperature semiconductor devices
Materials for high-temperature semiconductor devices
Materials for high-temperature semiconductor devices
Materials for high-temperature semiconductor devices
Major benefits to system architecture would result if cooling systems for components could be eliminated without compromising performance. This book surveys the state-of-the-art for the three major wide bandgap materials (silicon carbide, nitrides, and diamond), assesses the nat…
Creep and fracture of engineering materials and structures: proceedings of the 9th international conference h…
by Institute of Materials (Great Britain), Parker, J. D., (Jon D.), International Conference on Creep and Fracture of Engineering Materials and Structures, University of Wales, Swansea)
fromBook / Institute of Materials
Creep and fracture of engineering materials and structures: proceedings of the 9th international conference h…
by Institute of Materials (Great Britain), Parker, J. D., (Jon D.), International Conference on Creep and Fracture of Engineering Materials and Structures, University of Wales, Swansea)
fromBook / Institute of Materials
This conference was held at the University of Wales, Swansea, UK 1st - 4th April 2001. The 75 papers cover creep fundamentals and the creep properties of a range of materials including ceramics, composites, magnesium, aluminium, intermetallics, superalloys, low alloy steels and …
Covers the mechanical behavior of ceramic matrix composites at elevated temperatures. Topics include both short-term behavior (strength, fracture toughness, and R-curve behavior) and long-term behavior (creep, creep-fatigue, delayed failure, and lifetime).--Résumé de l'éditeur.
