Materials Under Extreme Conditions: Recent Trends and Future Prospects analyzes the chemical transformation and decomposition of materials exposed to extreme conditions, such as high temperature, high pressure, hostile chemical environments, high radiation fields, high vacuum, h…
Materials Under Extreme Conditions: Recent Trends and Future Prospects analyzes the chemical transformation and decomposition of materials exposed to extreme conditions, such as high temperature, high pressure, hostile chemical environments, high radiation fields, high vacuum, h…
This book is an overview of replication technology for micro- and nanostructures, focusing on the techniquesand technology of hot embossing, a scaleable and multi-purpose technology for the manufacture of devices such as BioMEMS and microfluidic devices which are expected to rev…
This book is an overview of replication technology for micro- and nanostructures, focusing on the techniques℗ and technology of hot embossing, a scaleable and multi-purpose technology for the manufacture of devices such as BioMEMS and microfluidic devices which are expected to r…
This book is an overview of replication technology for micro- and nanostructures, focusing on the techniques and technology of hot embossing, a scaleable and multi-purpose technology for the manufacture of devices such as BioMEMS and microfluidic devices which are expected to re…
This book is an overview of replication technology for micro- and nanostructures, focusing on the techniques & nbsp;and technology of hot embossing, a scaleable and multi-purpose technology for the manufacture of devices such as BioMEMS and microfluidic devices which are expecte…
This book is an overview of replication technology for micro- and nanostructures, focusing on the techniques and technology of hot embossing, a scaleable and multi-purpose technology for the manufacture of devices such as BioMEMS and microfluidic devices which are expected to re…
Provides in-depth knowledge on novel materials that make electronics work under high-temperature and high-pressure conditions This book reviews the state of the art in research and development of lead-free interconnect materials for electronic packaging technology. It identifies…
Provides in-depth knowledge on novel materials that make electronics work under high-temperature and high-pressure conditions This book reviews the state of the art in research and development of lead-free interconnect materials for electronic packaging technology. It identifies…
This exhaustive work in several volumes and over 2500 pages provides a thorough treatment of ultra-high temperature materials (with melting points around or over 2500C). The first volume focuses on carbon (graphene/graphite) and refractory metals (W, Re, Os, Ta, Mo, Nb and Ir), …
