Thesiss

The objective of the research is to model the impact of physical design characteristics on backend dielectric reliability. Backend dielectric breakdown is a concern for a number of reasons. The impact of process on backend dielectric reliability is significant, and well modeled,…

This paper investigates the performance of bundles of Single Wall Carbon Nanotubes (SWCNT) for low-power and high-speed interconnects for future VLSI applications. The power dissipation and delay of SWCNT bundle interconnects are examined and compared with that of the Cu interco…