Thesiss

Chemical mechanical polishing (CMP) planarization process is an important step in fabrication for multi-layer metallization to create and design IC metallization and via interconnections. Fill synthesis methodologies are innovated by inserting dummy fill structures into the surr…

The desire to assess the reliability of emerging scaled microelectronics technologies through faster reliability trials and more accurate acceleration models is the precursor for further research and experimentation in this relevant field. The effect of semiconductor scaling on …