Thesiss

The thermal diffusivities of three Sn-based solder alloys (Sn-3%wtAg-0.5%wtCu, Sn-4%wtAg-0.5%wtCu, and Sn-3.8%wtAg-0.7%wtCu), were determined from room temperature to up to 120°C. In addition to the lead-free alloy, the thermal diffusivity of the binary constituent alloys Cu6Sn5…