Lithography process control

Lithography process control

by Levinson, Harry J.

Type Book
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This text covers lithography process control at several levels, from fundamental through advanced topics. The book is a self-contained tutorial that works both as an introduction to the technology and as a reference for the experienced lithographer. It reviews the foundations of statistical process control as background for advanced topics such as complex processes and feedback. In addition, it presents control methodologies that may be applied to process development pilot lines.

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Title Statements

  • Full title :Lithography process control / Harry J. Levinson.

Summary

This text covers lithography process control at several levels, from fundamental through advanced topics. The book is a self-contained tutorial that works both as an introduction to the technology and as a reference for the experienced lithographer. It reviews the foundations of statistical process control as background for advanced topics such as complex processes and feedback. In addition, it presents control methodologies that may be applied to process development pilot lines.

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Edition Statements

  • Publication Date:©1999.

Publication Statements

The Physical Object

  • Description:1 online resource (x, 190 pages) : : illustrations

Edition Identifiers

  • ISBN:9781615837366, 1615837361, 9780819478559, 0819478555
  • DOI:10.1117/3.322162
  • oclc:ocn697188897
  • LC Classification:TK7871.85
  • Dewey Decimal:621.3815/2

Table of Contents

1. Introduction to the use of statistical process control in lithography -- The assumptions underlying statistical process control -- The properties of statistical process control -- Situations in lithography where statistical process control cannot be applied naively -- Non-normal distributions -- Process capability -- 2. Sampling -- Choosing the proper sample size -- Measurement location considerations -- Correlations -- Measurement frequency -- Systematic sources of variation -- 3. Simple and complex processes -- Definitions -- Why test wafers are useful -- How to address complex processes in lithography -- Distinguishing between layer-specific and equipment-specific effects -- 4. Linewidth control -- Cause and effect -- Independent variables -- Exposure dose -- Resist thickness -- Focus -- Bake temperatures -- Resist development -- Humidity -- DUV resists--special considerations -- Contributions from reticles -- Maximizing the process window -- 5. Overlay -- Overlay models -- Matching -- Contributions from processing and alignment mark optimization -- Addressing the problem of non-normal distributions -- Outliers -- 6. Yield -- Yield monitor strategy -- Yield models -- Paramet…

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