Power integrity modeling and design for semiconductors and systems
by Engin, Arif Ege Swaminathan, Madhavan
Ch. 1. Basic concepts -- 1.1. Introduction -- 1.2. Simple relationships for power delivery -- 1.3. Design of PDNs -- 1.4. Components of a PDN -- 1.5. Analysis of PDNs -- 1.6. Chip-package antiresonance: an example -- 1.7. High-frequency measurements -- 1.8. Signal lines references to planes -- 1.9. PDN modeling methodology -- 1.10. Summary -- Ch. 2. Modeling of planes -- 2.1. Introduction -- 2.2. Behavior of planes -- 2.3. Lumped modeling using partial inductances -- 2.4. Distributed circuit-ba…
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- Full title :Power integrity modeling and design for semiconductors and systems / Madhavan Swaminathan, A. Ege Engin.
Summary
Ch. 1. Basic concepts -- 1.1. Introduction -- 1.2. Simple relationships for power delivery -- 1.3. Design of PDNs -- 1.4. Components of a PDN -- 1.5. Analysis of PDNs -- 1.6. Chip-package antiresonance: an example -- 1.7. High-frequency measurements -- 1.8. Signal lines references to planes -- 1.9. PDN modeling methodology -- 1.10. Summary -- Ch. 2. Modeling of planes -- 2.1. Introduction -- 2.2. Behavior of planes -- 2.3. Lumped modeling using partial inductances -- 2.4. Distributed circuit-based approaches -- 2.5. Discretization-based plane models -- 2.6. Analytical methods -- 2.7. Multiple plane pairs -- 2.8. Summary -- Ch. 3. Simultaneous switching noise -- 3.1. Introduction -- 3.2. Simple models -- 3.3. Modeling of transmission lines and planes -- 3.4. Application of models in time-domain analysis -- 3.5. Application of models in frequency-domain analysis -- 3.6. Extension of M-FDM to incorporate transmission lines -- 3.7. Summary -- Ch. 4. Time-domain simulation methods -- 4.1. Introduction -- 4.2. Rational function method -- 4.3. Signal flow graphs -- 4.4. Modified nodal analysis (MNA) -- 4.5. Summary -- Ch. 5. Applications -- 5.1. Introduction -- 5.2. High-speed servers -- 5.3. High-speed differential signaling -- 5.4. Analysis of IC packages -- 5.5. Extraction of dielectric constant and loss tangent -- 5.6. Embedded decoupling capacitors -- 5.7. Electromagnetic bandgap (EBG) structures -- 5.8. Future challenges -- App. A.1. Multiport networks -- App. A.2. Matrix representation of transmission lines -- App. A.3. Spectrum of digital signals -- App. B. Software list.
Read More ↓Edition Statements
- Publication Date:2008.
Publication Statements
- Publisher(s):Prentice Hall
- Place of Publication:Upper Saddle River, NJ
- Language:eng
- Publication Date:2008.
Notes
Includes index.
The Physical Object
- Description:Online-Ressource.
Edition Identifiers
- ISBN:9780136152064, 0136152066
- oclc:ocn850706081
- LC Classification:TK7871.85
- Dewey Decimal:621.3815/2
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