3D IC devices, technologies, and manufacturing

3D IC devices, technologies, and manufacturing

by Xiao, Hong

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Title Statements

  • Full title :3D IC devices, technologies, and manufacturing / Hong Xiao.

Edition Statements

  • Publication Date:2016

Publication Statements

  • Publisher(s):SPIE Press
  • Place of Publication:Bellingham, Washington, USA
  • Language:eng
  • Publication Date:2016

The Physical Object

  • Description:xi, 189 Seiten : : Illustrationen ; : 26 cm

Edition Identifiers

  • ISBN:9781510601468, 1510601465
  • oclc:ocn990766385
  • Dewey Decimal:621.3815

Subjects

CIRCUIT DESIGN (MICROELECTRONICS) Circuits intégrés tridimensionnels DESSIN DES CIRCUITS IMPRIMÉS (MICROÉLEC… FABRICATION EN ÉLECTROTECHNIQUE, ÉLECTR… FERTIGUNG IN DER ELEKTROTECHNIK, ELEKTR… MICROELECTRONICS + INTEGRATED CIRCUITS MICROÉLECTRONIQUE + CIRCUITS INTÉGRÉS MIKROELEKTRONIK + INTEGRIERTE SCHALTUNG… PRODUCTION IN ELECTRICAL ENGINEERING, E… SCHALTKREISENTWURF (MIKROELEKTRONIK) Three-dimensional integrated circuits

Writers

Xiao, Hong

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