Green electronics - green bottom line: environmentally responsible engineering by Goldberg, Lee H. 0 Type: Book
Semiconductor packaging: materials, interaction and reliability by Chen, Andrea, Hsiao-Yu Lo, Randy 0 Type: Book
Fundamental principles of optical lithography: the science of microfabrication by Mack, Chris A. 0 Type: Book
Process Technology for Silicon Carbide Devices by Zetterling, C.-M fromEMIS processing series 0 Type: Book
Three-dimensional integration and modeling: a revolution in RF and wireless packaging by Lee, Jong-Hoon, Tentzeris, Manos M. fromSynthesis lectures on computational electromagnetics 0 Type: Book
Advanced technologies for next generation integrated circuits fromIET materials, circuits and devices series 0 Type: Book
Nanoelectronic devices by Park, Byung-Gook, Park, Young June, Hwang, Sung Woo fromPan Stanford textbook series in nanotechnology 0 Type: Book
Hybrid assemblies and multichip modules by Kear, Fred W. fromManufacturing engineering and materials processing 0 Type: Book
