Inverse Problems and Related Topics: Shanghai, China, October 12-14, 2018 by Jin Cheng, Masahiro Yamamoto, Shuai Lu 0 Type: Book
Modeling, Analysis, Design and Tests for Electronics Packaging Beyond Moore by Che, Faxing, Lin, Tingyu, Zhao, Wensheng, Jin Cheng fromWoodhead Publishing Series in Electronic and Optical Materi… 0 Type: Book
