Modeling, Analysis, Design and Tests for Electronics Packaging Beyond Moore

Title Statements

• Full title :Modeling, Analysis, Design and Tests for Electronics Packaging Beyond Moore

Edition Statements

• Publication Date:2019.

Publication Statements

• Publisher(s):Elsevier Science & Technology
• Place of Publication:San Diego
• Language:eng
• Publication Date:2019.

The Physical Object

• Description:1 online resource (436 pages)

Edition Identifiers

• ISBN:9780081025338, 0081025335
• oclc:on1128445955
• LC Classification:TK7870
• Dewey Decimal:621.3815

Subjects

Writers

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