Modeling, Analysis, Design, and Tests for Electronics Packaging Beyond Moore

Modeling, Analysis, Design, and Tests for Electronics Packaging Beyond Moore

by Faxing Che

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Title Statements

  • Full title :Modeling, Analysis, Design, and Tests for Electronics Packaging Beyond Moore

Edition Statements

  • Publication Date:2019.

Publication Statements

The Physical Object

  • Description:1 online resource

Edition Identifiers

  • ISBN:9780081025321, 0081025327, 9780081025338, 0081025335
  • oclc:on1229569410
  • LC Classification:TJ7870.15
  • Dewey Decimal:621.381046

Subjects

Appareils électroniques -- Emballage Electronic apparatus and appliances ; P…

Writers

Faxing Che Hengyun Zhang Tingyu Lin Wensheng Zhao

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