Modeling, analysis, design, and tests for electronics packaging beyond Moore

Modeling, analysis, design, and tests for electronics packaging beyond Moore

by Zhang, Hengyun

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Title Statements

  • Full title :Modeling, analysis, design, and tests for electronics packaging beyond Moore / Hengyun Zhang, Faxing Che, Tingyu Lin, Wensheng Zhao.

Edition Statements

  • Publication Date:2020

Publication Statements

The Physical Object

  • Description:1 online resource

Edition Identifiers

  • ISBN:9780081025338, 0081025335
  • oclc:on1128034384
  • LC Classification:TJ7870.15
  • Dewey Decimal:621.381046

Subjects

Appareils électroniques -- Emballage Electronic apparatus and appliances ; P…

Writers

Zhang, Hengyun Che, Faxing Lin, Tingyu Zhao, Wensheng

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