Modeling, analysis, design, and tests for electronics packaging beyond Moore

Modeling, analysis, design, and tests for electronics packaging beyond Moore

by Zhang, Hengyun

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Title Statements

  • Full title :Modeling, analysis, design, and tests for electronics packaging beyond Moore / Hengyun Zhang, Faxing Che, Tingyu Lin, Wensheng Zhao.

Edition Statements

  • Publication Date:2019

Publication Statements

  • Publisher(s):Woodhead Publishing
  • Place of Publication:Oxford
  • Language:eng
  • Publication Date:2019

The Physical Object

  • Description:xvi, 418 pages : illustrations : 23 cm

Edition Identifiers

  • ISBN:9780081025321, 0081025327
  • oclc:on1285674495
  • LC Classification:TK7870
  • Dewey Decimal:621.381046

Subjects

Appareils électroniques -- Emballage Electronic apparatus and appliances ; P…

Writers

Zhang, Hengyun Che, Faxing Lin, Tingyu Zhao, Wensheng

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