Modeling, analysis, design, and tests for electronics packaging beyond Moore

Modeling, analysis, design, and tests for electronics packaging beyond Moore

by Zhang, Hengyun

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Title Statements

  • Full title :Modeling, analysis, design, and tests for electronics packaging beyond Moore / Hengyun Zhang, Faxing Che, Tingyu Lin, Wensheng Zhao.

Edition Statements

  • Publication Date:2019.

Publication Statements

  • Publisher(s):Woodhead Publishing
  • Place of Publication:Place of publication not identified
  • Language:eng
  • Publication Date:2019.

The Physical Object

  • Description:1 online resource.

Edition Identifiers

  • ISBN:9780081025338, 0081025335
  • oclc:on1139625645
  • LC Classification:TJ7870.15
  • Dewey Decimal:621.381046

Subjects

Appareils électroniques -- Emballage Electronic apparatus and appliances ; P…

Writers

Zhang, Hengyun Che, Faxing Lin, Tingyu Zhao, Wensheng

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