Electronic packaging -- Congresses

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The objective of this special collection is to provide a showcase for researchers, educators, engineers and government officials, involved in the general areas of Components, Packaging and Manufacturing Technology, by which to highlight the latest research results and to exchang…

This volume provides a comprehensive state-of-the-art assessment of the fundamentals of the Microscale heat transfer and transport phenomena and heat transfer and applications in Microsystems. The modern trend toward miniaturization of devices requires a better understanding of …