Interconnects

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Advanced technologies for next generation integrated circuits

fromIET materials, circuits and devices series

0 Type: Book

IC component sockets

by Pecht, Michael, Liu, Weifeng

0 Type: Book

Development of constitutive equation parameters and reliability evaluations of tin-silver-copper interconnects

by Mohammad Masum Hossain

0 Type: Thesis

Impact of introducing lead-free solder due to the legislation restriction, generates numerous researches to characterize the lead-free alloys and evaluate the interconnect reliability. The objective of this dissertation is to characterize the SnAgCu alloy and also evaluation of …

Evaluation and improvement of the robustness of a PCB pad in a lead-free environment

by Jing Li

0 Type: Thesis

The lead-free requirement in electronics has significantly impacted second-level interconnection reliability due to modification of the solder alloy, laminate material and related assembly processes. Pad cratering, which refers to the fracturing of the resin under the connecting…