TSV 3D RF integration

TSV 3D RF integration: high resistivity Si interposer technology

by Ma, Shenglin

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Title Statements

  • Full title :TSV 3D RF integration : high resistivity Si interposer technology / Shenglin Ma and Yufeng Jin.

Edition Statements

  • Publication Date:2022.

Publication Statements

  • Publisher(s):Elsevier
  • Place of Publication:Amsterdam, Netherlands
  • Language:eng
  • Publication Date:2022.

The Physical Object

  • Description:1 online resource.

Edition Identifiers

  • ISBN:0323996035, 9780323996037
  • oclc:on1320852579
  • LC Classification:TK7874.893
  • Dewey Decimal:621.3815

Subjects

Radio frequency integrated circuits Silicon -- Electric properties Three-dimensional integrated circuits

Writers

Ma, Shenglin Jin, Yufeng

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