Thesiss

Impact of introducing lead-free solder due to the legislation restriction, generates numerous researches to characterize the lead-free alloys and evaluate the interconnect reliability. The objective of this dissertation is to characterize the SnAgCu alloy and also evaluation of …

The lead-free requirement in electronics has significantly impacted second-level interconnection reliability due to modification of the solder alloy, laminate material and related assembly processes. Pad cratering, which refers to the fracturing of the resin under the connecting…