Thesiss

The lead-free requirement in electronics has significantly impacted second-level interconnection reliability due to modification of the solder alloy, laminate material and related assembly processes. Pad cratering, which refers to the fracturing of the resin under the connecting…

This research contains two studies. First study investigated one of the factors that affect the performance of pads; the locations of pads relative to glass weave. Dage 4000plus bond tester was used in conducting a joint-level testing of pads on 370HR printed circuit board that …