Advanced wirebond interconnection technology

Advanced wirebond interconnection technology

by Prasad, Shankara K.

Type Book
Rate 0.0 /5
Details
Files
Reviews
Download

Title Statements

  • Full title :Advanced wirebond interconnection technology / Shankara K. Prasad.

Edition Statements

  • Publication Date:2004.

Publication Statements

The Physical Object

  • Description:668 p.

Edition Identifiers

  • ISBN:1402077629, 9781402077623
  • oclc:ocn936964161
  • LC Classification:TK7836
  • Dewey Decimal:621.381/046

Subjects

Electronic packaging -- Reliability Microcâblage -- Production Mise sous boîtier (Électronique) -- Fia… Wire bonding (Electronic packaging) -- …

Writers

Prasad, Shankara K.

Rate & Review

0.0/5
(0 people Voted)

No reviews yet. Be the first to rate this work.

Files & Downloads

No downloadable files are registered for this work yet.

Log in to request a copy