Advanced wirebond interconnection technology: design - materials - equipment - process - quality - reliability

Title Statements

• Full title :Advanced wirebond interconnection technology : [design - materials - equipment - process - quality - reliability] / by Shankara K. Prasad

Edition Statements

• Publication Date:2004

Publication Statements

• Publisher(s):Kluwer Academic Publishers
• Place of Publication:Boston, Mass
• Language:eng
• Publication Date:2004

The Physical Object

• Description:XXVIII, 668 Seiten : Illustrationen, Diagramme : 24 cm

Edition Identifiers

• ISBN:1402077629, 9781402077623, 1402077637, 9781402077630
• oclc:ocn834509505
• LC Classification:TK7836
• Dewey Decimal:621.381046

Subjects

Writers