Advanced Wirebond Interconnection Technology

Advanced Wirebond Interconnection Technology

by Prasad, Shankara K.

Type Book
Rate 0.0 /5

From the reviews: "" ... intended for an assembly production house setting, appropriate for management, designers, chief operators, as well as wirebond production engineers ... This book has excellent overall tutorial and enough description of wire and bonding equipment ... If you have not read a wirebonding book, or the one you read 10 years ago was borrowed and never returned, now is the time to buy this book."" (IEEE CPMT, Newsletter) ""This book is intended for an assembly ... is very good …

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Title Statements

  • Full title :Advanced Wirebond Interconnection Technology

Summary

From the reviews: "" ... intended for an assembly production house setting, appropriate for management, designers, chief operators, as well as wirebond production engineers ... This book has excellent overall tutorial and enough description of wire and bonding equipment ... If you have not read a wirebonding book, or the one you read 10 years ago was borrowed and never returned, now is the time to buy this book."" (IEEE CPMT, Newsletter) ""This book is intended for an assembly ... is very good with 'visual' explanations for quick grasping of the issues. ... The book has a clear prose style and a ver.

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Edition Statements

  • Publication Date:2006.

Publication Statements

  • Publisher(s):Springer US
  • Place of Publication:Boston
  • Language:eng
  • Publication Date:2006.

The Physical Object

  • Description:1 online resource (1 volume)

Edition Identifiers

  • ISBN:1280148241, 9781280148248, 9786610148240, 6610148244, 1402077637, 9781402077630, 1402077629, 9781402077623
  • oclc:on1181165406
  • LC Classification:TK7836 .P715 2004eb
  • Dewey Decimal:004.6

Table of Contents

Preliminaries -- Contents -- Preface -- Acknowledgments -- Chapter 1: Introduction -- Chapter 2: Materials for Wirebonding -- Chapter 3: Bonding Equipment -- Chapter 4: Process Technology -- Chapter 5: Quality -- Chapter 6: Reliability -- Chapter 7: New Technologies and New Applications for Wire Bonding -- Appendices -- Index -- About the author

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