Advanced wirebond interconnection technology

by Prasad, Shankara K.

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Title Statements

  • Full title :Advanced wirebond interconnection technology / by Shankara K. Prasad.

Edition Statements

  • Publication Date:2004.

Publication Statements

Notes

El. reprodukcija.

The Physical Object

  • Description:xxviii, 668 str. : : ilustr. ; : 24 cm.

Edition Identifiers

  • oclc:ocn839973062
  • LC Classification:TK7836
  • Dewey Decimal:621.381/046

Subjects

Electronic packaging -- Reliability Microcâblage -- Production Mise sous boîtier (Électronique) -- Fia… Wire bonding (Electronic packaging) -- …

Writers

Prasad, Shankara K.

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