Modern high performance Integrated Circuits (ICs) are pushing the limits of Two Dimensional (2D) planer technologies in terms of power and frequency scaling. Manufacturers and researchers are looking at the Three Dimensional (3D) IC as a method to overcome power delivery and wir…
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Computer systems are woven into the human society, their applications ranging from critical infrastructures, such as health care systems and power plants, to ordinary usages, such as mobile phones and smart cards. Dependability of the applications heavily relies on the security …
In this thesis we present new methods that contribute to higher fault coverage and shorter test time for testing bridging faults in VLSI circuits. We present a hierarchical bridging fault extraction method which has same degree of accuracy as a flat extractor. In addition, it is…
Yield and reliability are two factors affecting the profitability of semiconductor manufacturing. In the manufacturing process of modern VLSI semiconductor devices, gate-oxide defects have been found as one of the major causes for the reliability problems of CMOS integrated circ…
The trend in the integrated circuit industry towards an ever greater miniaturization of circuit components accentuated reliability problems such as electromigration in the power buses, hot-carrier degradation of transistors, and excessive power consumption, which ultimately resu…